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Description: FSF (Free Standing Films) are self-supporting films of
thermal interface material. They are thixotropic. The entire
interface melts to create a very low thermal resistance path at very
low closure force between component and heat sink.
Type FSF-71
"Tacky2" is naturally tacky on both sides. It can be easily applied
to a heat sink by peeling off the easy to remove release liner from
one side and pressing it against the heat sink. It will adhere to
the heat sink by simple pressure. When the component is installed
and heat and slight pressure are applied, the interface material
changes phase and creates a very low thermal resistance path between
component and heat sink. This material, in addition to being tacky
at room temperature is also a thermoplastic adhesive. That is, after
being melted, then resolidified between a heat sink and electrical
component, the two will be adhered together. Reheating above the
phase change temperature can easily break this thermoplastic
bond.
FSF materials
are not electrically conductive but contain nothing to prevent
metal-to-metal contact between component and heat
sink. |