Description:

This material facilitates applications where die-cut parts or Thermaps (Thermal Rod Applicators) can't be used. This hot-melt adhesive material is a solid at room temperature.  When heated and dispensed from standard hot melt equipment it can be used to create thermal pads and shaped parts that would not be possible with die-cut parts, or with Rodaps.  Note that per part cost can be very low because you eliminate the cost of die-cutting and of manual assembly. 

When this material is in a molten state it is thixotropic (like thick shaving cream).  By pressing an electronic component into the molten material the thermal compound flow into the micropores of component and heat sink (or PC board), expulsing air from these pores and creating a strong adhesive bond and efficient thermal interface.  Excess thermal material is extruded from under the component and forms a "bead" of material around the perimeter of the component.  The thinnest possible interface is created.  The excess material at the component perimeter forms a seal around the component. Thermaphase Hot-Melt material is not electrically conductive, but it has no barrier in it to prevent metal to metal contact between component and heat sink.

This hot-melt adhesive material is Thermoplastic and exhibits RAB (Reversible Adhesive Bonding).  When the material has reflowed under heat and pressure and then recools below the phase change temperature it bonds the component to the heat sink.  The component can be removed at any time by reheating.  This can be done an unlimited number of times.  This product feature can be used to adhere components to heat sinks, replacing mechanical fasteners.