Advantages:

• Thermal Resistance 0.03 C/W/in² at 10 psi
• Phase Change Temperature 71°C
• Naturally tacky on both sides both before and after reflow
• Manufacturing Friendly - easy to use
• Thixotropic and won't flow from gaps
• Thermoplastic reversible adhesive bond
• Use for creating thermal interface patterns on component and heat sinks
• Use for conformal coating, gap filling, potting

Description: 
"Tacky2" Hot Melt material can be applied to surfaces using manual or automatic dispensing equipment, by injection molding, or by screen-printing, in any required pattern. Once the Hot Melt material has been applied to a surface and recooled to the solid state, it is naturally adhesive at room temperature. For example, the transistor in the above picture can be pressed against a heat sink, at room temperature and will adhere to it. Adhesive strength is 25 psi. Note that this material is not electrically conductive, but contains nothing to prevent component to heat sink electrical/mechanical contact. Special "Tacky2" materials are available which do prevent electrical/mechanical contact between the heat sink and component. Contact ORCUS, inc. for more information. When "Tacky2" material is reheated above its phase change temperature the adhesive bond is broken and the component is easily removed. "Tacky2" is thermoplastic. Unlike thermal epoxies, which are thermosetting, "Tacky2" can be melted and re-solidified an unlimited number of times. Unlike messy epoxy thermosetting materials, "Tacky2" does not require long cure times. You only need to elevate the temperature of the "Tacky2" long enough for it to flow into the surface pores of component and heat sink (or other surface).