98°C Thermaps

Thermal Rod Applicators (98°C)
for manual or high speed component-heat sink attachment.

 

Advantages: High Speed automated attachment of components to heat sinks (or PC boards) Very low equipment investment Can also be used for prototype work Lowest available thermal resistance: 0.05 °C/W/in² at 10psi Differential Phase Change allows one or two phase operation Controlled sub-micron particulate morphology for superior void filling Organo-metallic wetting action promotes lamellar flow Controlled Thixotropicity eliminates migration Thermoplastic adhesion can eliminate fasteners Reversible Adhesive Bond (RAD) Solid State Operation can eliminate out gassing Environmentally friendly/Non-Toxic/UL approved Easy to use/Manufacturing Friendly

Note:  This thermal material  is not electrically conductive but contains no substrate to prevent metal to metal contact between component and heat sink. Description: Thermaphase "Thermaps" are solid rods of thixotropic  (FSF-98) material which can be used for manual or automatic attachment of components to heat sinks (or PC boards). When the rod material is touched briefly to a heated surface, this thermal interface material becomes a soft thixotropic substance (much like thick shaving cream).  The molten thermal materials adheres to the heated surface when the Thermap is removed.   When a component is pressed down into the molten material,  it flows into the micropores of component and heat sink, expulsing air from the pores.  The distance between component and heat sink decreases as the thermal compound flows into the pores and surface irregularities.  Excess FSF material is extruded from under the component and forms a "bead" of material around the perimeter of the component.  The thinnest possible interface is created.  The excess material at the component perimeter forms a seal around the component. Thermaphase FSF material is not electrically conductive, but has no barrier in it to prevent metal to metal contact between component and heat sink. This material is Thermoplastic and exhibits RAB (Reversible Adhesive Bonding).  When the material has reflowed under heat and pressure and then recools below the phase change temperature, it bonds the component to the heat sink.  The component can be removed at any time by reheating.  This can be done in unlimited number of times.  This product feature can be used to adhere components to heat sinks replacing mechanical fasteners. You can use these "Thermaps" for prototype work by simply "painting" pads onto heat sinks or other flat surfaces.  For production work, the "Thermap" is brought down vertically each time and prints the heat sink with a thermal pad similar to the rod cross sectional shape.  The tip of the rod retains its cross sectional shape because the thermal material is thixotropic, non-flowing.  When the component is pressed onto the heat sink and the thermal interface material allowed to change again to the solid state, the component is firmly adhered to the heat sink (tensile strength >25psi).

Typical Characteristics: