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Thermaphase on Aluminum Foil (52°C)

"Thermafoil"
Advantages:
  • Lowest available thermal resistance:
    0.06°C/W/in² at 10psi
  • Aluminum foil heat spreader
  • Low mounting force so you can use clips, not screws
  • Differential Phase Change Characteristic allows one or two-phase operation
  • Controlled particulate morphology for superior void filling
  • Organo-metallic wetting action promotes laminar flow
  • Controlled Thixotropicity  eliminates migration
  • Thermoplastic adhesion can eliminate fasteners
  • Reversible Adhesive Bond (RAB) characteristic eliminates outgassing
  • Easy to handle - "manufacturing friendly"
  • Excellent solvent resistance
  • Precision metered coating 0.5 to 6.0 mils thick
  • Available with different compound thickness on each side of Foil
  • Environmentally friendly/Non Toxic
  • Available with Zero DT adhesive backing

Description: 
This product consists of high thermal conductivity aluminum alloy foil heat spreader, precoated on both sides with ORCUS Thermaphase 52°C Differential Phase Change Material. The material is dry-to-the-touch and flexible at room temperature.  This is the original material that started the Differential Phase Change Material revolution years ago.  When this material is placed between two rigid, rough, uneven surfaces and heat (>52°C) and pressure (10.0psi) are applied the following occurs:

1) When the heat exceeds 52°C (either from  electronic component heat-up or because of externally applied heat) the Thermaphase material becomes a soft, thixotropic (much like thick shaving cream).

2) The physical pressure on the component causes the Thermaphase material to flow into the micropores of the component and heat sink, expulsing air from these pores.  The distance from the component to the Kapton and from the Kapton to the heat sink decreases as the Thermaphase material enters the pores and surface irregularities.  Excess material is extruded from under the component and forms a "bead" around the perimeter of the component.  The thinnest possible interface is created.