Advantages:

• Thermal Resistance 0.06°C/W/in² at 15psi
• Naturally tacky on both sides for easy
  application to heat sink
• Manufacturing Friendly - easy to handle
• Thixotropic and won't flow from gaps
• Excellent heat spreading characteristic
• Precision metered coating 0.5 to 6.0 mils thick
• Available with different compound thickness on each side of foil
• Thermoplastic reversible adhesive bond

Description: 
"Tacky2"- 71°C Thermaphase compound is precoated onto a 2-mil Aluminum substrate. This material is slightly adhesive at room temperature. It can be temporarily adhered to heat sink surfaces by simply pressing it firmly onto the heat sink. When the temperature of this material exceeds the reflow temperature, the compound reflows and fills all of the pores of both electronic component and heat sink to form a very low thermal resistance interface. The material requires only 10psi of closure force to flow when in the molten state and creates a very thin thermal interface. This material is thermoplastic. It can be reflowed and solidified innumerable times. After initial reflow and when re-solidified by cooling to a temperature below the phase temperature, this material has an adhesive strength of 25psi. Simply heating above the phase change temperature for component removal can break the adhesive bond. This material can replace thermally conductive epoxies in most applications. It is not a thermosetting material like epoxy. It can operate either in the solid or reflowed state.