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Thermapplicators 71°C

Description: 
FSF (Free Standing Films) "Tacky2" Thermaps are preformed rods of Thermaphase FSF-71°C material. Thermaps can be used to apply thermal interface areas to heat sinks. These applicators can be used manually or in automatic equipment for high volume production. When touched to a preheated heat sink, the thermal material reflows and applies a thermal pad to the heat sink. If a larger pad is desired, the rod can be moved over the heat sink surface to paint a pad of any desired size. The thixotropic viscoelastic character of this material prevents the tip of the rod from deforming from repeated use. Thermaps make it easy to apply thermal interface material to contoured surfaces where it would be difficult or impossible to place a preformed thermal interface pad. This material is thermoplastic. "Tacky2" Thermap material is not electrically conductive but contains nothing to prevent metal-to-metal contact between component and heat sink.

Typical Characteristics:
Thermal Characteristics Units Thermap 71°C
Thermal Resistance at 10psi. °C/W/in² 0.03
Specific Heat of Thermaphase Cp 1801.6
Phase Change Temperature °C 71
Use Temperature °C -60 to +200
Mechanical Characteristics Units Thermap 71°C
Moisture Absorption (substrate) % 5
Viscosity at 100°C (poise) Poise >100
Electrical Characteristics Units Thermap 71°C
Volume Resistivity W-cm 1014
Density g/cc 2.1
Tensile Strength of Thermoplastic Bond   25

 

Thermal Resistance versus Closure Force



Product Availability:

Standard Thermaps are 0.5 x 0.5" x 8" long. We can supply, on special order, various desired profiles and sizes.

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